The mounting structure is insulative, and preferably comprises a direct bond to copper board.
该安装结构是绝缘的，并且优选地包括直接接合到铜的板。
The success of Cr-Zr-Cu mold copper board not only can save us lost of money, but also it has significant meaning to improve the continuous equipment and technology to our country.
铬锆铜结晶器铜板研制成功，不仅每年可为宝钢节约大量费用，而且对提高我国的连铸技术及装备水平有重大意义。
Apply to: apply to: acid electroplated copper electric circuit board electroforming mould and electroplating for printing plate making etc.
适用于：酸性电镀铜、线路板、电铸模、制版电镀等。
This paper introduces the use of electrohydraulic proportional control system to copper electro - cathode board die machine in the automatic product line.
介绍电液比例控制技术在铜电解阴极板自动线冲铆机上的应用，分析了电液比例压力控制系统的设计特点。
This paper introduced a new copper treatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.
本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
Adding copper traces on both sides of the board to form guard rings around the circuit's high-impedance nodes diverts leakage currents (Figure 3).
在电路板的两面敷铜形成保护环，可以在电路高阻抗节点周围转移漏电流(图3)。
The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。
It includes non - magnetizer basis material covered by copper film, winding covered by copper film and non-magnetizer material board.
它包括覆铜箔板非导磁基材、覆铜箔线圈和非导磁材料板。
Cyanate compound, the preparation of triazine copper clad panel and 1ts application in high frequency printed circuit board were introduced in this paper.
本文介绍了氰酸酯化合物，三嗪覆铜板的制备及其在高频线路板上的应用。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
This paper analyzed the main influential factors of the copper foil board base paper, and put forward control measures combining with the practice production, which…
通过对影响覆铜箔层压板原纸主要因素的分析，结合生产实际提出了控制措施，对该产品的生产有一定的借鉴意义。
So to produce the suitable low profile electronic copper foil for high density circuit board (HDI) is more difficult and pressing.
要生产出适合于高密度电路板(HDI)使用的低轮廓电子铜箔更加困难和紧迫。
Copper and plastic compounds and mixtures of copper and plastic separation: such as electronic circuit board copper foil recycling, waste plastic recycling copper and copper wire.
铜和塑料复合物及铜和塑料混合物分离：如电子线路板覆铜铜箔的回收，废旧铜线铜和塑料的回收。
Copper and plastic compounds and mixtures of copper and plastic separation: such as electronic circuit board copper foil recycling, waste plastic recycling copper and copper wire.
铜和塑料复合物及铜和塑料混合物分离：如电子线路板覆铜铜箔的回收，废旧铜线铜和塑料的回收。
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