The researching status and developing trends of cobalt alloy coatings in properties of protection, magnetism, decoration, electrochemical catalytic behavior and copper barrier are focused.
重点探讨了钴合金在防护性、磁性、装饰性、电催化功能和防铜渗性等方面的研究现状和发展趋势。
Diffusion coefficient of copper in barrier coating is a considerable parameter for evaluating barrier ability.
铜在防渗铜镀层中的扩散系统是评价镀层防渗铜能力的重要参数。
Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit.
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.
铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。
Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
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