Then a second circuit layer is formed on the insulation layer and the surface of the basic board, at last, the continuous process such as forming a welding cover.
及形成一第二线路层于该绝缘层上，其特征在于：所述绝缘层是通过进行一电泳沉积程序而形成于该第一线路层的外表面上，且所述绝缘层仅覆盖了该第一线路层；
Then a second circuit layer is formed on the insulation layer and the surface of the basic board, at last, the continuous process such as forming a welding cover.
及形成一第二线路层于该绝缘层上，其特征在于：所述绝缘层是通过进行一电泳沉积程序而形成于该第一线路层的外表面上，且所述绝缘层仅覆盖了该第一线路层；
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