The contact pad has a second part (142), extending away from a first part (141), for further reducing the current density in the conductive layer (120).
所述触板具有远离第一部分(141)而延伸的第二部分(142)，以用于进一步减少导电层(120)中的电流密度。
The probe clamp includes at least two probes for contacting electrically the second contact pad and connecting the second part of the connection structure.
探针卡设置于托盘上，其包含用以电性接触第二接触垫与连接结构第二部分的至少两支探针。
A tiny electronic pad is placed onto the retina of one eye, so that the electrodes are in direct contact with the ganglion cells.
一个微小的电子衬垫被放置在单侧眼睛的视网膜上，这样电极就可以与神经节细胞直接接触了。
Indirect printing Process where the printing surface is not in direct contact with the paper, e. G. Offset printing, pad printing, etc.
间接印刷印版并不直接与纸张接触的印刷方法。例如柯式印刷、移印等。
The contact behavior between the reinforcement pad and the vessel shell was analyzed with nonlinear method of the software ANSYS.
采用ANSYS软件的非线性分析方法，模拟分析了补强圈与壳体之间的接触行为。
The first gate and the second gate are electrically connected, and the second gate is connected with a contact wire to be connected to a pad for transmitting a gate control signal.
该第一栅极及第二栅极电性相连，且该第二栅极连接一接触线，以连接至一焊垫以传输栅极控制信号。
A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
一种半导体器件(10)，具有在最后的互连层(16)和接合焊盘之间的接触，该接合焊盘包括接合焊盘(28)和最后的互连层(16)之间的阻挡金属(26)。
It shows in experiments that the contact area between the wire and the pad has possesses long elliptical shape, and the welded area was periphery of the contact area.
实验显示，金线和焊接平台的接触界面为长椭圆形状，其中焊接部位发生在接触界面的周边。
Mainly used in the drawer mat, ambry mat, eat mat, the pad, and so on, the product to choose the color, the grain according to company or by the guest requirements... Welcome to contact us!
主要用于抽屉防滑垫，橱柜垫，餐垫，台垫等等，产品颜色任意选择，纹路按照公司或按客人要求定做…欢迎联系我们！
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).
随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).
随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。
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