Also, the added schottky diode can be easily realized by schottky contact in the drain of the NMOSFET, which does not add chip area.
且该电路结构中肖特基二级管可在NMOSFET漏极直接制作肖特基金半接触来方便地实现，工艺简明可行又无须增加芯片面积。
Dust can easily lead to poor contact socket and board, in addition, some CARDS on the motherboard, the form of chip pins, and is often due to oxidation and poor contact pin.
灰尘很容易引发插槽与板卡接触不良，另外，主板上一些插卡、芯片采用插脚形式，也常会因为引脚氧化而接触不良。
Method of calculation for the non-contact IC card chip coupling power supply and the read and write distance were analyzed, and the relative low-voltage circuit designs were introduced.
分析了非接触式IC卡芯片耦台电源及读写距离的计算方法，并简要介绍了相关低压电路的设计技术。
The Texas Instruments TMP006/B Infrared Thermopile Sensor in a Chip-Scale Package (Figure 3) provides non-contact temperature sensing for use in health, beauty, and flame-detection applications.
德州仪器TMP006 /B红外热电堆传感器的晶片级封装（图3）提供非接触式温度传感器用于保健，美容，和火焰检测应用。
The most obvious thing the chip allows me to do is store my contact information on it, so that I can just touch a phone with NFC and pass my information to their phone.
他在接受澳大利亚《每日邮报》采访时说道：“这块芯片带给我最大的帮助就是可以储存我的联系人信息。这样一来，我只需要轻触一台带有NFC芯片的手机，就可以将我的信息发送到指定联系人的手机上。
Because of the influences of such factors as machining tolerance etc., the contact thermal resistance between chip and cold plate can't be controlled effectively.
由于表贴器件制造公差的影响，器件与冷板间的接触热阻无法有效控制。
Through cutting experiments in which the contact length between chip and rake face of restricted contact cutter is reduced step by step, the variation principle of cutting force is studied.
通过切削试验，研究了限制接触刀具前刀面的刀—屑接触长度逐渐减小时切削力的变化规律。
This was due to the increase in the contact area at the tool-chip and tool-work interface due to the presence of flank and crater wear.
这是由于增加了接触面的工具，芯片和工具的工作界面因侧翼和火山口的磨损。
But it is not easy to visualize how it is accomplished in the case of a continuous turning with a single point turning tool, specially when the chip-tool contact pressure is as high as 70 MPa.
可是，如果要使切削液起作用就必须让它到达切屑刀具接触界面。但如何在采用单尖刀具连续车削的场合尤其是切屑-刀具接触压力高达70mpa时实现并非易事。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
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