The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
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