The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。
Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.
史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。
The physical properties, solderability, mechanical properties and the creep-rupture life of the nanon-sized Ag particles reinforced Sn-37Pb composite solder were investigated.
研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。
The physical properties, solderability, mechanical properties and the creep-rupture life of the nanon-sized Ag particles reinforced Sn-37Pb composite solder were investigated.
研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。
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