Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
The mould component can be used for testing exothermic solder molten metal mobility.
该模具组件可以用以测试放热焊接剂熔化金属流动性。
In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.
采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。
The utility model relates to a mould component, in particular relates to a mould component for testing exothermic solder molten metal mobility.
本实用新型涉及一种模具组件，尤其涉及一种用以测试放热焊接 剂熔化金属流动性的模具组件。
It introduced drawing, punching progressive dies for solder pieces and analyzed the processing ability of the component for stamping and punching. The structure of the die was designed reasonably.
介绍了焊片零件拉伸、冲裁多工位级进模，分析了零件的冲压工艺性，并对模具结构进行了合理的设计。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps.
在将电子组件安装在基板上的方法中，所述基板和所述电子组件中的至少一个上的电极端子由焊点组成。
Provided is a surface mounting component wherein a shock applied to constitution members in manufacturing process is reduced and sufficient solder bonding strength is achieved after surface mounting.
提供一种表面安装部件，其可以缓和对制造工序中的构成组件产生的冲击，并使表面安装后的焊接强度的达到充分大。
PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。
PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。
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