Provided are a chip component mounting structure and a chip component mounting method for increasing density.
本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。
The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined.
本发明旨在提供一种能够组合可修复性和冲击抗性的电子部件安装结构。
In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive.
在电子部件安装结构中，第一电路板和第二电路板通过电子部件安装粘合剂来结合。
Component mounting sequence is critical to the efficiency of surface mounting machines.
元器件贴装顺序是影响贴片机工作效率的关键因素之一。
Component mounting sequence is critical to the efficiency of surface mounting machines.
元器件贴装顺序是影响贴片机工作效率的关键因素之一。
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