Multiple printed circuitboard for electronic components esp. acoustic surface wave elements, and method for constructing bumps, soldering frames, spaces on said multiple printed circuitboard.
用于电子元件特别是声学表面波元件的多路印刷线路板以及在多路印刷板上构造针脚焊点，焊接架，隔片等的方法。
Multiple printed circuitboard for electronic components esp. acoustic surface wave elements, and method for constructing bumps, soldering frames, spaces on said multiple printed circuitboard.
用于电子元件特别是声学表面波元件的多路印刷线路板以及在多路印刷板上构造针脚焊点，焊接架，隔片等的方法。
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