Their first strategy is a technique, common in chip manufacturing, called doping, in which atoms of some other element are added to a semiconductor crystal.
第一步策略是一个在芯片产业上普遍使用的技术，叫做“掺杂”，就是在半导体晶体中加入其它元素的原子。
Second-ranked computer memory chip maker Hynix Semiconductor and Japan's Elpida memory swung to deep losses as prices of DRAM chips used in PCs tumbled about 50 percent in the third quarter.
排在第二位的电脑内存芯片生产商海力士半导体和日本的尔必达存储器公司在电脑用DRAM芯片销售价格上损失惨重，在第三季度跌落50%。
"The term 'embedded' used to refer to a low-level, limited-function semiconductor and nobody needed to pay attention to it," said Shane Rau, a chip expert at the market research firm IDC.
“过去，术语‘嵌入式’指低水平的、功能有限的半导体，人们也无需关注它，”市场调研公司国际数据公司(IDC)的芯片专家谢恩·劳说。
NAND flash supply has reportedly become tighter as major chip producers Samsung Electronics, Toshiba, Micron and Hynix Semiconductor favor demand for Apple devices.
由于三星，东芝以及海力士等闪存芯片大厂需要优先满足苹果的需求，因此导致了闪存芯片供需状况越发紧张的状况。
Hyundai Heavy Industries co., the world's biggest shipbuilder, slumped 6.6 percent. Hynix Semiconductor, the world's second-largest memory chip maker, fell 3.3 percent.
世界上最大的船舶制造厂商，韩国现代重工股票大跌6.6% .世界上最大的存储芯片制造商，韩国海力士半导体股价下跌3.3%。
The semiconductor company that owns most of the business for computer processors said Tuesday it will invest between $6 and $8 billion in its U.S. chip manufacturing facilities.
这家占据电脑处理器市场大部分份额的半导体公司周二表示，将向其在美芯片生产设施投入60至80亿美元。
To do all this, you are probably going to need chip-manufacturing machines from Applied Materials, one of the main suppliers of such equipment to the semiconductor industry.
其实归根结底，你还是需要去美国应用材料公司（Applied Materials）购置一套芯片加工设备，应用材料公司是半导体工业设备的主要供应商之一。
The result is the Torrent chip, a semiconductor device that analyses genomes.
这一想法导致了Torrent芯片，一种可分析基因的半导体的诞生。
Tool shipments are running at a rate suggesting annual semiconductor capital spending of $40bn to $50bn, a level that has tended to cause meaningful rises in chip manufacturing capacity in the past.
以目前半导体设备的出货量计算，半导体行业的年度资本支出将达到400亿至500亿美元，在过去，这一支出水平往往表明，芯片制造产能将出现大幅度的增长。
The semiconductor, or "chip", was first added to a calculator in 1967, to a toy in 1978, and to a toaster in 1983.
半导体，或者“芯片”，于1967年首次植入计算器，于1978年首次植入玩具，于1983年首次植入烘烤机。
The semiconductor, or "chip," was first added to a calculator in 1967, to a toy in 1978, and to a toaster in 1983.
半导体，或者说“芯片”，在1967年首次应用到计算器，1978年应用于玩具，1983年应用于烤箱。
The model is based on the semiconductor laser rate equations and the structure of the VCSEL chip, and every element in the circuit is represented.
等效电路的提出是基于半导体激光器速率方程以及VCSEL芯片结构，电路中各元件都有严格的物理意义。
The influence of parasitic interconnect capacitance is much in evidence with the progress of the semiconductor techniques and the increase of chip density and calculated speed.
随着半导体工艺的进步，芯片集成度和运算速度的提高，互连寄生效应的影响也日益明显。
Six years earlier, Robert Noyce, the founder of Fairchild Semiconductor, had patented the silicon chip.
六年前，Fairchild半导体公司的创始人robert Noyce申请了硅芯片专利。
"Actions chip" means the semiconductor chip designed and provided by Actions.
“炬力芯片”指炬力研发并提供的半导体芯片。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Fixed abrasive wire saw is recognized as one of the best methods in cutting large size semiconductor chip and function crystal because of its incomparable advantages.
在大尺寸半导体基片和功能晶体的切割中。固结磨料线锯以无可比拟的优点被认为是最好的切割方法之一。
Laser based splitting method, object to be split, and semiconductor element chip.
基于激光的分割方法，待分割物体，和半导体元件芯片。
Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.
这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。
The tremendous development of semiconductor technology and electronic design automation (EDA) made the system on a programmable chip (SOPC) possible.
随着半导体技术和电子设计自动化（EDA）的迅猛发展，使系统级可编程芯片（SOPC）成为可能。
The coupling characteristics of tapered and lensed fiber (TLF) and semiconductor MQW planar lightwave circuit (PLC) chip was investigated experimentally.
对锥形透镜光纤(TLF)与半导体多量子阱(MQW)平面光波光路(PLC)芯片的耦合特性进行了实验研究。
It has utilized the construction of data transmission platform based on Wireless USB by using chip CYWUSB6953, which is the newly PSoC chip made by Cypress Semiconductor Corp.
利用赛普拉斯半导体公司新型的片上可编程芯片CYWUSB6953来完成基于无线usb技术的数据传输平台的构建。
An accurate method for measuring the chip temperature of semiconductor lasers is presented.
提出了一种精确测量半导体激光器结温的方法。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
The driving chip DRV592 drove the semiconductor cooler linearly, and the algorithm of fuzzy self-tuning PID was adopted to improve the precision of controlling temperature.
利用DRV592驱动芯片对半导体制冷器进行线性驱动，采用模糊自整定PID控制算法来提高控温精度。
With the rapid improvement of VLSI technology and semiconductor technology, the large amounts of hardware which is needed by vector processing can be integrated in a single chip.
VLSI技术和半导体工艺的飞速发展，使向量处理所需的大量硬件可以集成在一块芯片内。
Neural cell based biosensors, with neurons cultured on the semiconductor sensor chip, are suitable for long-term and non-invasive measurement of cell electrophysiological properties.
将神经元培养在半导体传感器芯片表面，构建出能够对细胞电生理特性进行长时程无损测量的神经细胞传感器，具有广阔的生物医学应用前景。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.
至少一个半导体芯片(例如麦克风芯片)安装在基座部上并且在屏蔽板的正上方。
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