The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
The Texas Instruments TMP006/B Infrared Thermopile Sensor in a Chip-Scale Package (Figure 3) provides non-contact temperature sensing for use in health, beauty, and flame-detection applications.
德州仪器TMP006 /B红外热电堆传感器的晶片级封装（图3）提供非接触式温度传感器用于保健，美容，和火焰检测应用。
The Texas Instruments TMP006/B Infrared Thermopile Sensor in a Chip-Scale Package (Figure 3) provides non-contact temperature sensing for use in health, beauty, and flame-detection applications.
德州仪器TMP006 /B红外热电堆传感器的晶片级封装（图3）提供非接触式温度传感器用于保健，美容，和火焰检测应用。
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