Fortunately, smaller chip manufacturing processes make all of that possible without significant sacrifice, and recycled materials are becoming easier to refine and use.
幸运的是，更小的芯片制程使得这一切都成为可能而无需付出很大的代价，而回收的材料也更容易被使用。
Though prototype chips with optical-communications systems have been built in the lab, they rely on exotic materials that are difficult to integrate into existing chip-manufacturing processes.
虽然实验室里已经造出了原型芯片，但它们采用的特殊材料很难被整合到当今的芯片制造工艺中。
Figure 3-2 illustrates the necessary relationship between cutting tool and the workpiece for chip formation in several common machining processes.
图3 - 2说明了在一些普通切削成型加工工艺中，切削刀具和工件之间必要的关系。
By constructing a metal cutting model using slip-line field theory, chip curling radii are predicted theoretically in orthogonal cutting processes.
通过采用滑移线场理论，建立了一种正交切削模型，使用这一模型，从理论上预测了切屑卷曲半径。
The design gives the signal conditioning circuit, accomplishes the hardware interface design of DSP chip TMS320VC5410 and chip -to-speech TLC320AD50C, and processes audio signal by FIR arithmetic.
介绍一种高保真的音频信号处理系统，给出了前端音频信号调理电路设计，实现了DSP芯片TMS320VC5410与语音转换芯片TLC320AD50C的硬件接口设计，并通过FIR算法实现了对音频信号的处理。
Bonding is one of key processes for fabrication of microfluidic chip.
键合是微流控芯片制作的关键技术之一。
This thesis study the simulation of electromagnetic field of MB chip and two key fabrication processes—fabrication of planar electromagnetic devices based on UV-LIGA and polymeric microfabrication.
本论文研究了磁珠芯片中的电磁场模拟分析，以及两种关键工艺——基于UV-LIGA的平面电磁器件制作工艺和塑性材料微加工制作工艺。 在此基础上，设计、制作并封装了新型磁珠微芯片。
Based on some related micro machining processes, a process flow is planed to fabricate make the piezoresistive sensor chip successfully.
基于一些相关的微加工工艺制定了制作这种微传感器的工艺流程并且制作成功了传感芯片。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
The purpose is making use of single chip micro-computer to control four processes of mutual welding of reinforcing steel bar, which makes automatic mutual welding realize really intelligent control.
利用单片机对钢筋对接焊的四个过程进行控制，使全自动对接焊真正实现智能控制。
Manufacturing processes chip removal - Part 1: Turning; Classification, subdivision, terms and definitions.
排屑加工工艺。第1部分：车削。分类、细分类、术语和定义。
The control system of equipment that uses the MCS-51 single chip, 89C51, as the CPU mainly processes the temperature control and display.
温针治疗仪的控制系统以89C51单片机为核心，主要进行温度控制及温度显示控制。
The control system of equipment that uses the MCS-51 single chip, 89C51, as the CPU mainly processes the temperature control and display.
温针治疗仪的控制系统以89C51单片机为核心，主要进行温度控制及温度显示控制。
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