Operating system: AIX 5l v5.3 TL04 (system type: 9116-561, two quad chip modules).
操作系统：aix5lv5.3TL 04(系统类型：9116- 561，两个4芯片模块)。
Further, it USES Dual Chip Modules (DCMs) and Multi-Chip Modules (MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.
此外，它还分别使用双芯片模块(DCM)和多芯片模块(MCM)作为其中端服务器和高端服务器的基本构建块。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
With the increase of system integration and application demands, more and more digital and analog modules are embedded in a single chip.
随着系统集成度和应用需求的增加，越来越多的数字模块和模拟模块内嵌在同一芯片中。
Its structure, including the main sensor detection modules, single-chip information processing module, data modules, and modules such as feedback control.
主要其结构包括传感检测模块，单片机信息处理模块，数据显示模块和反馈控制等模块。
To drive motion components, the thesis examines the controlling principle of DC motor and the methods and circuits of using the DSP chip and DC motor control modules to realize the DC motor control.
为驱动运动部件，本文研究了直流电机控制原理以及利用DSP芯片结合直流电机控制模块实现直流电机控制的方法和电路。
Setting up IP reuse modules for Liquid Crystal on Silicon display chip.
建立硅基液晶显示芯片的IP重用设计模块。
This terminal's hardware design mainly includes the choice of microprocessor chip, the interface design of MC35 module of communication, the circuit design of memory modules and serial port and so on.
该终端的硬件设计，主要包括微处理器芯片的选型、MC35通讯模块的接口设计、存储器单元及串口电路设计等。
Because the system is designed in modules, and some highly integrated special purpose chip are used, the structure of the system is very concise and the management is very convenient.
由于系统使用了具有较高集成度的专用芯片，使得系统结构简洁明了，运行监控非常方便。
Robot controller is designed with RVD chip, under RVD software environment, function modules based on configuration principle can be established with according to requirement of flow chart.
采用RVD处理芯片设计机器人控制器，根据流程需要，在RVD软件环境下建立组态原理功能模块。
This article firstly demonstrated the Formula of the signal generator, then give the overall diagram of system. We focuses on the signal modules of the composition of the DDFS chip AD9833.
本文首先对信号发生器的设计方案进行了论证，接着提出了系统的整体设计框图，重点论述了由DDFS芯片AD9833构成的信号发生模块的设计。
Node A module that can communicate over the network data to other modules. A module contains a Neuron Chip.
接点接点是含有神经元芯片的模块，可以通过网络数据与其他模块通讯。
The chip comprises ultrasonic sensor driver circuit, time measurement control, temperature measurement control, STOP signal conversion such as modules design.
该芯片包括超声波探头驱动电路、测时控制电路、测温控制电路、STOP信号转换电路等模块。
In this thesis, we illustratre the theory of the chip, system design, partition of the modules, simulation and realization of analog circuit and layout design.
本文对芯片工作原理、系统架构设计、模块划分、前端模拟电路实现、版图设计等进行了详细分析。
This topic is mainly done with DSP chip TMS320VC5509A as the core on the PCB board design and combined with the CCStudio software debugging board of each functional modules.
本课题主要是完成以DSP芯片TMS320 VC 5509a为核心的板卡的设计与结合CCS软件对PC B板卡的各功能模块进行调试。
In the later part of the thesis, detailed analysis is made for the realization principles of the switching structure and internal function modules of multiplayer. switching chip BCM5615.
之后文章对多层交换芯片BCM5615的交换结构、内部各个功能模块的原理实现以及芯片中的二、三层数据流程作了比较详细的分析。
Making use of ti's DSP chip TMS320LF2407A, all modules work well and the system meets the requirement for testing precision and operation speed.
通过TI公司的TMS320 LF 2407 ADSP芯片，对各个模块协调控制，达到系统的精度要求和实时性要求。
Allow users to flash SPD data on the onboard flash chip instead of the SPD flash chip on the memory modules.
允许用户闪存社民党数据板载闪存芯片取代社民党闪存芯片的内存模块。
On-chip passive inductors, basic elements of wireless mobile communication circuits, are highly required in RFIC and widely used in simulating unit modules such as LNA, VCO and filters.
无源片上电感是RF IC中需求很高的器件，被广泛地应用在LNA、VCO、滤波器等模拟单元模块中，构成了无线移动通信电路的基础。
STC89C52 microcontroller modules: microcontroller STC89C52 single-chip, reset circuit, clock circuit constitute the core of the whole system.
STC 89c52单片机模块：由单片机STC 89c52单片机、复位电路、时钟电路等构成，是整个系统的核心。
This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.
本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。
A wireless calling system for hotel administration is described. The system, in which wireless transmitting and receiving modules are used, is controlled by a single-chip computer.
采用无线发射、接收模块，结合单片机控制，设计一种应用于酒店的无线呼叫管理系统。
A wireless calling system for hotel administration is described. The system, in which wireless transmitting and receiving modules are used, is controlled by a single-chip computer.
采用无线发射、接收模块，结合单片机控制，设计一种应用于酒店的无线呼叫管理系统。
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