The higher calories which the higher power consumption bring out make the chip encapsulation and coolant device's cost increase more, even there are technique restrictions.
高功耗带来的高热量使得芯片的封装和散热装置造价巨增，并存在技术上的限制。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip.
本文研究了一种用于去除封装材料的数控精密激光切割技术。
The research objects include power module, power plane, ground plane, bypass capacitor, encapsulation of high-speed chip and inside power distribution.
研究对象包含了组成电源分配系统的电源模块，电源平面、接地平面、旁路电容和高速芯片的封装及内部电源分配等问题；
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
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