The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.

最大累积等效蠕变应变位于内层焊点，且在芯片边缘。

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The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.

最大累积等效蠕变应变位于内层焊点，且在芯片边缘。

youdao