In this paper, with the current demand for electronic chip cooling, using fluid dynamics finite element analysis software FLO EFD.
本文结合目前电子芯片的散热需求，使用流体力学有限元分析软件FLOEFD。
Refrigerant gases generated by the semiconductor chip cooling, the current provided by the battery, the electric motor acts as blast equipment.
制冷气体由半导体制冷片产生，电流由蓄电池提供，鼓风设备由电动机充当。
By comparison of solutions obtained under various cooling conditions, the theory ground was provided for adopting appropriate methods to restrain the deformation of the resistance chip.
通过不同冷却条件下计算结果的比较，为制动电阻片采取合适的方法抑制变形提供了依据。
This paper introduces the application of the single chip microcontroller that works as the fuzzy controller on the intelligent controlled cooling system of the Auto engine.
介绍了以单片机为模糊控制器的汽车发动机冷却系统的智能控制系统。
The analysis results prove that the designed chip has uniform temperature distribution and higher temperature rising and cooling rates and could meet the requirement of PCR.
分析结果表明设计的聚合物芯片温度分布均匀，有较高的升、降温速率，可以满足PCR反应的要求。
The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels.
冷却界面可结合 至电子元件如芯片上，冷却介质供给到通道组中的至少一组。
The invention discloses a chip absorbing and cooling connecting piece used for a boring end effector, which is installed on the front plate of the supporting unit of the boring end effector.
本发明公开了一种用于钻孔末端执行器的吸屑和冷却连接件，该连接件安装在钻孔末端执行器的支承单元的前板上。
The invention discloses a chip absorbing and cooling connecting piece used for a boring end effector, which is installed on the front plate of the supporting unit of the boring end effector.
本发明公开了一种用于钻孔末端执行器的吸屑和冷却连接件，该连接件安装在钻孔末端执行器的支承单元的前板上。
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