Their arrogance is unbelievable, yet how many fathers play ball or chip a golf ball with their sons when out for the day on some rough land.
他们的骄傲自大，令人难以相信，但是多少父亲和儿子出去一天一起去玩球，在一些粗糙的土地上。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
You can see the ball going in the hole before you make that magical stroke or drive, maybe even a chip.
你在那神奇的一推之前、甚至是在切滚球时就知道球一定会进洞。
Chip giant Intel Corp. is expected to get the ball rolling Tuesday with its fifth - straight upbeat earnings report.
预计芯片巨头英特尔(Intel Corp。)将率先于周二公布连续第五个季度实现收益增长。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.
最大累积等效蠕变应变位于内层焊点，且在芯片边缘。
The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.
最大累积等效蠕变应变位于内层焊点，且在芯片边缘。
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