• Due to the latency difference between main memory and on-chip memory cache, POWER7 was designed with three levels of on-chip cache (see Figure 1).

    由于内存芯片级内存缓存之间延迟差别,POWER 7设计三种级别芯片级缓存机制(1)。

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  • To deliver a major performance boost, chip-makers have resorted to putting several processors, or cores, on the same chip.

    为了实现效能的有效提升芯片退而采取更多的处理器(多)放到同一个芯片上。

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  • Data from the card is obtained from a magnetic stripe or chip on the card; the latter system is called chip and PIN in the United Kingdom and Ireland, and is implemented as an EMV card.

    信用卡数据卡片上的磁条芯片读取。芯片系统英国爱尔兰称为芯片和个人身份认证码系统,习惯性地叫EMV卡。

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  • The first chip actually had several chips on one single motherboard, but was refined to one RISC chip with more than 1 million transistors.

    第一芯片实际上主板上几个芯片但是优化一个包含超过一百万个晶体管RISC 芯片。

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  • Basically, a DNA strand is pushed through a 2nm hole on a silicon chip and, as it moves through, that chip is able to use an electrical charge to read the strand's coding sequence.

    DNA被拉进硅基芯片的直径2nm随着穿过小孔,芯片可以通过电荷读取链上编码序列。

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  • Many of the keitai-credit systems rely on a NFC chip called FeliCa, which was developed by Sony. This chip is embedded in both NTT DoCoMo's wallet phones and the new Pasmo system.

    许多手机信用系统借助一种名为灵通卡(FeliCa)短距通讯芯片发挥作用,芯片索尼公司研制,内置于NTT的手机钱包新的帕斯系统

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  • L3 directory on chip reduces off-chip delays after an L2 miss.

    芯片L 3目录可以减少发生l2未命中之后的离片延迟

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  • By creating more than 1,000 mini-circuits within the FPGA chip, the scientists effectively turned the chip into a 1,000-core processor - each core working on its own instructions.

    这样一来,研究人员现场可编程门阵列芯片上创造出来1000个迷你电路,成功电脑芯片变成1000处理器每个核心各自的指令下执行任务。

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  • Higher performance of the on-chip interconnection is needed because of the improvement of the system-on-chip integration and application requirements.

    应用需求增长系统芯片集成度不断提高,对系统芯片片上互连结构提出了更高的要求。

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  • This paper focuses on performance estimation of the embedded microprocessor based on the on-chip bus, including on-chip bus modeling, high-level simulation environment building and their combination.

    论文主要工作即着重于系统芯片总线结构性能评价研究,包括总线结构的建模、系统仿真环境建立以及性能评价的方法。

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  • At present, most of the stenographs on the market have separate image processing chip and motor controlling chip, and cant print via a computer.

    目前市场大部分印机的图像处理电机控制芯片是分立的,并且电脑直接打印功能。

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  • Because the chip is connected to a quartz capillary, the electrophoresis on the chip can be directly detected by a UV absorption detector.

    由于芯片本身带有根石英毛细管所以紫外吸收检测器可以直接进行电泳检测

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  • Then supplies realization of Encryption Chip based on Permutation Code by EDA, and integrates the modular of signal gathering so the chip can be used in voice communication encryption.

    通过EDA设计技术实现排列加密算法,加密芯片中集成信号采集模块可以使芯片应用语音通讯加密当中。

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  • LED chip is fixed on aluminium layer of aluminium base PCB. The heat from chip can be spread out through aluminium layer rapidly.

    led芯片直接封装上,芯片所产生热量可以迅速通过铝层向外传到

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  • The basic structure and principles of wearable medical system on chip were introduced and the performance of different wireless communication standards for wearable medical chip was summarized.

    概述穿戴医疗系统芯片基本组成工作原理,对适用于穿戴式医疗芯片无线通信技术标准进行讨论。

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  • The influences of some cutting parameters on chip curvature and mechanism of chip-curling are also studied.

    本文研究了一些切削参数切屑卷曲影响规律及切屑卷曲过程机理

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  • Preorder module IP core is widely used in the design of System on chip (SOC), IP core is becoming the kernel component in the designing of future chip.

    系统芯片(SOC)设计大多采用ip为主的预定制模块,IP核已经成为未来主流芯片设计核心构件

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  • Studies heart rate testers based on integration heartbeat detection chip and introduces other components of the testers such as reflective infrared sensor, single-chip and LED display.

    研究基于集成心跳探测芯片的心跳测试仪介绍了组成部分,反射式红外传感器单片机LED显示器。

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  • According to the applied characteristics of the KA3525, a regulated power supply circuit based on a PWM controlled chip and controlled by single-chip processor was designed.

    根据KA3525应用特点设计一种基于该电流型PWM控制芯片单片机控制实现输出电压可的稳压电源电路

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  • This paper introduces the advantage of PIC single chip and provides an intelligent community network system based on PIC single chip technology.

    本文介绍PIC系列单片机特点提出一种基于PIC系列单片机技术社区智能化系统

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  • This paper introduced a single chip microcomputer system in low power ullage based on flash memory disk which core is USB - HOST COMS - chip SL811HS.

    本文介绍了一个嵌入式usb主机接口芯片sl 811hs核心,采用U存储介质的单片机功耗海量存储系统

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  • Electric water heater based on single-chip timing controller programming, the use of single-chip temperature sensor.

    基于单片机热水器定时控制器程序设计,单片机温度传感器使用

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  • On the basis of analyzing the system construction of the ISD phonetic chip, a kind of system structure of the phonetic chip based on phonetic segment management is designed.

    ISD系列语音芯片体系结构进行分析的基础上,设计了一基于语音管理的语音芯片体系结构

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  • The measurement results on the fabricated CMOS neuromorphic chip are consistent with the biological measurement results. Thus the biological functions of the chip have been successfully verified.

    结果显示,金氧半场效电晶体场效电晶体神经型态运作方式生物量测结果相符因此成功地验证了该晶片的仿生功能

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  • A dictate converter has been designed by using chip computer 89c51, serial extended chip 8251, interrupted extended chip 8259, and so on.

    采用89c51单片机串口扩展芯片8251、中断扩展芯片8259等器件设计一种指令格式转换器

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  • It has utilized the construction of data transmission platform based on Wireless USB by using chip CYWUSB6953, which is the newly PSoC chip made by Cypress Semiconductor Corp.

    利用赛普拉斯半导体公司新型片上可编程芯片CYWUSB6953来完成基于无线usb技术数据传输平台构建

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  • The structure principle of DNA biosensor, DNA chip, DNA sequencing technique, pooled DNA, Laboratory on chip (LOC) are introduced in this paper.

    本文简要介绍了其中DNA生物传感器、DNA芯片、DNA测序技术混合DNA样品池、微芯片实验室结构原理

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  • Based on turning with inclined large cutting edge, a certain pulling force is exerted on chips in the flow chip plane to perform chip - pulling machining.

    本文倾角斜角车削为基础,平面内切屑施加一定拉力进行切削

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  • The essay introduces multi-chip calculator communication system based on RS-485 bus, especially MAX-487 chip and the components of the communication system and gives the flow diagram.

    介绍基于RS-485总线单片机多机通信系统重点介绍了MAX-487芯片通信系统的组成给出了流程图。

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  • Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.

    刚性基板倒装式和晶圆再分布式两种结构的芯片封装CSP进行了研究描述了CSP的工艺流程

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