It's as though the ordinary earthly objects, we bump into them or they bump into us, and they get us to look upwards to the heavenly Platonic realm.
这就像普通的地球物体，我们撞到它们，或者它们撞到我们，它们让我们仰望天堂的柏拉图王国。
We bump into societies that may be more or less just, or individuals who may be more or less just, but we never bump into justice itself.
我们可能遇见或多或少有点正义的社会，或多或少有点正义的个人，但是我们决不会撞见正义本身。
The wind swung his corpse back and forth so that it thumped against the tree. Bump. Bump. Bump.
风吹着他的尸首前后摇晃，尸体撞在树上，发出嘭，嘭，嘭的闷响。
The calculation results show that the bump prevention device on train can damp the impact and reduce the bump action force effectively.
计算结果表明，列车防碰撞装置能够较好地减缓冲击，降低碰撞作用力。
Journalist: you have said even we want to bump, it can't bump on, haven't you?
记者问：请问你不是说火车想撞也撞不上吗？
During the match today we brought out a variation of the chest bump. We did the reverse - a butt bump.
今天比赛的时候，我们表演了撞胸的变种——撞PP，反过来哈哈。
The method of analyzing buoy position drift and bump based on GPS is introduced in detail and the model of judgement for buoy bump is given.
详细介绍了基于GPS的浮标位置漂移、撞击分析方法，给出了浮标受撞击判断模型；
In this paper, the structure and working principle of the new drilling mud bump-7NB mud bump were introduced.
介绍了一种钻井用新型泥浆泵—7 N B泥浆泵的结构特点、工作机理和研究情况等。
The invention provides a bump structure on a substrate, comprising at least a first electrode, at least a first bump and at least a second bump.
本发明提出一种基板上的凸块结构，其包括至少一第一电极、至少一第一凸块以及至少一第二凸块。
Some methods such as gas-lift, beam bump and submersible bump are usually used in oilfield with high water content.
目前，国内外高含水油田一般采用气举、有杆泵、电潜泵等采油方式。
The second bump is disposed on the substrate, wherein the height of the second bump is higher than the height of the first bump.
第二凸块配置于基板上，其中第二凸块的高度高于第一凸块的高度。
With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.
本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
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