This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.
本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
Some information on the progress of new techniques of nondestructive testing (NDT) applied in solid rocket motor propulsion and de-bonding of multiple interface is discussed in this paper.
文中阐述了无损检测新技术在固体发动机推进剂及多界面脱粘方面取得进展的部分情况。
Some information on the progress of new techniques of nondestructive testing (NDT) applied in solid rocket motor propulsion and de-bonding of multiple interface is discussed in this paper.
文中阐述了无损检测新技术在固体发动机推进剂及多界面脱粘方面取得进展的部分情况。
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