The method for evaluating bonding reliability is presented.
介绍了焊接可靠性的评价方法。
Bonding reliability of electrically conductive adhesives (ECAs) is very important to their application.
导电胶的粘接可靠性是制约其应用的主要影响因素。
Nowadays, bonding reliability of electrically conductive adhesives (ECAs) has become one of the difficulties in its application.
导电胶的粘接可靠性是制约其应用的主要影响因素。
Through the control tests for several failure modes of bonding technique, it summarizes a relatively complete set of controlling measures for enhanced bonding reliability.
通过对粘片工序几种失效模式的对比试验、总结了一套针对该工序的较为完整的粘片可靠性增长的控制措施。
Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
介绍各向异性导电胶导电机理和粘接工艺，以及影响它的粘接可靠性因素和最佳参数的研究，如粘接温度、固化时间、粘接压力、粒子含量等。
Then it analyzes the reliability problems of the bonding between spun gold and gold conductor, and proposes an improved measure after summarizing the causation of spun gold bonding fault.
分析了金丝与金导体键合的可靠性问题，总结了金丝键合失效的原因，并提出了改进的措施。
The results offer the foundation of bonding structure and material life reliability on long-life satellite in our country, emerge the prospect of nano-material using in the space.
研究结果为中国长寿命卫星胶接结构、材料的寿命可靠性提供了相关依据，展现了纳米材料空间应用的前景。
By using the improved bonding process, the reliability of the detector can be enhanced greatly.
改进后的焊接工艺可大幅提高探测器的可靠性。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
It is difficult to guarantee the quality by earlier checking, so the wire bonding is one of the key factors affecting the SAW filter's performance and reliability.
由于内连质量很难通过中间过程的检测完全确定，因此，内连技术成为影响SAW器件性能和可靠性的关键之一。
There is a significant effect of the bonding parameters to the joint quality and reliability.
键合参数对键合点连接质量有重要影响。
There is a significant effect of the bonding parameters to the joint quality and reliability.
键合参数对键合点连接质量有重要影响。
应用推荐