The die comprises a plurality of die joining bonding pads on the surface of the die.
第一管芯，其包括管芯表面和位于所述管芯表面上的管芯接合焊盘；
At least one bonding pad in the one or more bonding pads does not connect any parts except the selected part in the said multiple parts.
所述一个或多个焊盘中的至少一个焊盘没有连接到所述多个器件中除所选器件之外的任何器件。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.
在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
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