A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一种激光焊接装置，能够迅速且方便地进行带覆层导线的覆层除去作业、对该带覆层导线和端子的激光焊接作业。
The shape of the concrete bonding surface is very irregular usually, and its measured data by fractional dimension device is a stochastic process.
通常混凝土粘结面的形状极不规则，其表面的分维仪测值是一随机过程。
Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
利用声学扫描检测技术，提示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
Metallic bonding can realize up -down assembly and improve the thermal property. But it has little influence on the original optical property of the device.
金属键合可以实现衬底倒扣和改善器件热学性能，而对器件原有的光学性质影响不大。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
According to the application comprehensive of the shield, equipotential bonding and surge protective device, the combination protection of the automatic system is realized.
综合应用屏蔽、等电位连接和电涌保护器等基本防护措施，实现了自动化系统的雷电综合防护。
In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
Such a machining device is used to remove material from workpieces (28) or for connecting workpieces (28) by bonding, especially by means of welding.
这种加工设备用于工件(28)上的材料侵蚀或工件(28)的材料连接，尤其用于工件焊接。
The ligating structure includes a channel (48) that is configured to receive a corrective device (16) therein and to restrict the corrective device from movement relative to the tooth bonding pad.
绑扎结构包括通道(48)，其配置以将矫正设备(16)接收于其中，并且限制矫正设备相对于牙结合垫的移动。
The ligating structure includes a channel (48) that is configured to receive a corrective device (16) therein and to restrict the corrective device from movement relative to the tooth bonding pad.
绑扎结构包括通道(48)，其配置以将矫正设备(16)接收于其中，并且限制矫正设备相对于牙结合垫的移动。
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