In order to study the interfacial bond strength better, this paper developed a new method and test device of the interface.
为更好地评价界面粘结强度，论文开发了界面的成型方法与测试装置。
In order to study the interfacial bond strength better, this paper developed a new method and test device of the interface.
为更好地评价界面粘结强度，论文开发了界面的成型方法与测试装置。
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