The electroplating techniques in BGA packaging were briefly introduced.
简要介绍了BGA型封装中的电镀技术。
This technique has been successfully applied in BGA chip leads 3-d measurement.
此技术已成功地应用于BGA芯片管脚的三维测量。
In large scale integrated chip field, the IC of BGA encapsulation was widely used.
在大规模集成芯片中以BGA(球栅阵列)封装的IC芯片被广泛使用。
We provide the welding tools, repair tools, fume extraction and BGA repair center.
我们提供的产品主要分焊接工具，返修工具，空气净化系统和BGA专用返修站。
Hands tin stove, electric cutting machine, BGA reworking station, assembly equipment.
手浸锡炉，电动切脚机，BGA返修站和元件成型设备一批。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
This technique has been successfully applied in the three-dimensional measurement of BGA chip leads.
此技术已成功应用于BG A芯片管脚的三维尺寸测量中。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Though clearing compositions and base character of BGA solid amendment, to improve theories were offered.
首先确定固体改良剂bga的基本成分，了解其基本性状，为改良理论提供基本依据。
Spur gear (SGA) or compound bevel gear (BGA) attachments can be provided in any position shown in Figure 1.
如果采用正齿轮(SGA)或复合伞齿轮(BGA)附件，则可以在图1中显示的各个位置安装手轮。
The BGA quality is connected with electronic fitting technology, but further research is needed for BGA repair.
BGA器件的质量与电装工艺的关系密切，但BGA器件的返修还需作进一步的研究。
After the study, the BGA line capacity is increased with optimized production, and realized the cost reduction.
通过本研究，实现了生产条件的最优化，提高了生产线的总体产能，最终达到了降低产品成本的目的。
Unique a 3 segments' temperature curve program achieves a steady heat rising and good protection of BGA component.
独设三段式温度曲线程序，实践分段升温控制，令BGA得到妥贴的保护。
Two final production assembly line , 30-worker-location hand-soldering line , BGA rework equipment imported from U.
两条手工插装及焊接生产线，可满足客户大批量焊接生产。
The BGA program can be described as a time-contingent increase in activities from baseline toward predetermined goals.
BGA计划可被描述为按时间将活动时间从基线提高到预定目标。
This paper adopts machine vision technology to solve exact inspection and accuracy orientation problems of BGA ball mounting.
本文研究的主要内容，就是采用机器视觉技术来解决BGA植球机研制过程中的准确检测和精确定位两大难题。
These products are unique for general testing, for high current, for high frequency, for wire harness as well as for BGA testing.
该类产品适用于各种领域的线路板测试， 光板，实板，高电流， 高频率，BGA测试。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
The paper firstly points out the key of the recognition of BGA by analysing the recognition tasks in the process of SMT placement production.
首先通过分析贴片机生产中BGA的识别任务，指出了实现BGA识别的关键；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
Solder Robert, BGA rework station, Automatic Glue dispenser, Video Microscope, Fume absorber, Soldering station, Solder pot, Ultrasonic cleaner, Cable tester, etc.
焊接机器人、BGA返修台、自动点胶机、视频显微镜、吸烟系统、焊台、锡炉、超声波清洗器。网络测试工具等。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.
着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。
According to the positioning and detecting problems of computer vision in the high speed and high precision SMT placement, the recognition arithmetic of BGA is researched.
针对高速高精度贴片机的计算机视觉检测与定位问题，研究了BGA芯片的图像识别对中问题。
The biomass of Euonymus japnicus was increased first, then decreased with increase of BGA dosage, and the water consuming intensity was increased all the while in greenhouse.
温室内大叶黄杨的生物量随BGA用量的增加先增加，后减小，耗水强度线性减少；
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
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