The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
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