• Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.

    着重介绍了电镀金金锡、锡、锡银化学工艺过程,最后简单介绍了制备凸点的电镀设备

    youdao

  • Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.

    着重介绍了电镀金金锡、锡、锡银化学工艺过程,最后简单介绍了制备凸点的电镀设备

    youdao

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