Moreover, when the thermoelectric elements are arranged with a high density, the force of each of the thermoelectric elements pulled by the substrate warp becomes smaller.
并且，通过将热电元件密配置，使由基板的弯曲而产生的拉伸每一个热电元件的力变小。
Moreover, when the thermoelectric elements are arranged with a high density, the force of each of the thermoelectric elements pulled by the substrate warp becomes smaller.
并且，通过将热电元件密配置，使由基板的弯曲而产生的拉伸每一个热电元件的力变小。
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