The manufacture of solder bump is one of the key technologies for area array packaging (AAP).

钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。

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The manufacture of solder bump is one of the key technologies for area array packaging (AAP).

钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。

youdao