陶瓷-金属复合挺柱结构设计的关键问题是连接方式。
The key problem of structural design of ceramic-metal composite tappet rod is the connecting manner.
陶瓷与金属组成的复合构件具有广阔的应用前景，而陶瓷与金属的连接技术是陶瓷工程应用的关键。
Ceramic - metal composite components have a wide application prospect, and the bonding technology of ceramics to metals is a key to the practical application of ceramics to engineering.
指出在陶瓷-金属挺柱的制造技术中，钎焊连接是陶瓷-金属复合挺柱最为重要的连接方法。
It is pointed out that braze welding is one of the most important joining methods in the ceramic-metal manufacturing technology.
陶瓷基复合材料是一种新兴的热结构材料，解决其自身及其与金属的连接工艺，是实现其推广应用的重要课题之一。
Ceramic matrix composites (CMCs) is one of newly developed thermal-structured materials. Self-joining of CMCs and its joining to metals become an important task to facilitate their application.
本文综述了适用于陶瓷与金属连接的各种方法，重点介绍它们的原理、特点、适用范围、最新进展及工程应用。
A number of available bonding processes are introduced in this review, and the emphases are placed on their principles, characteristics, limitations, latest progress and application in engineering.
实验证明：双螺母加弹性元件的连接方案能满足陶瓷与金属的可靠连接。
The test demonstrates that the arrangement of double nuts with an elastic element is very successful in providing a reliable connection for ceramics and metal.
在陶瓷与金属间用一定厚度的成分和结构呈梯度变化的梯度过渡层作为连接二者的焊缝层，是解决陶瓷与金属连接时所存在问题的较好措施之一。
The problem may be solved by using the gradient transitional layer, within which the composition and microstructure can vary gradiently, as a weld interlayer between ceramic and metal.
陶瓷与金属的连接技术是材料工程领域的热点研究课题，而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。
The bonding technique of ceramics to metals is one of the central issues in materials engineering, and diffusion bonding is considered to be the most suitable method for bonding ceramics to metals.
阳极键合是一种利用电和热相互作用实现固体电解质玻璃(陶瓷)与金属材料固态连接的一种新方法。
Anodic bonding is a new way to realize the bonding between solid electrolyte glasses (ceramics) and metals through the interaction process of electricity and heat.
该研磨纸可 用于众多工件的研磨和抛光，包括金属、金属合金、陶瓷、光学元件、光纤连接器、硬盘、半导体等领域。
The emery paper is applicable in the grinding and polishing of most work pieces including metal, metal alloy, ceramic, optical element, fiber connecter, hard disc and semiconductor, etc.
在分析金属-陶瓷场致扩散连接中残余应力产生原因的基础上，给出了降低这些因素影响的具体措施。
Based on the analysis on how the residual stress is generated from metal-ceramic filed diffusion bonding, detailed measures are given to lower the influence.
可适用于各种塑料瓶、玻璃瓶、陶瓷等非金属容器的封口，适用于各行业产品封口之用，可连接流水线配套使用。
It is suitable for sealing non-metal containers such as plastic, glass and porcelain bottles and also sealing products of various industries. It can be connected to the assembly line.
本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。
This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantage…
本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。
This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantage…
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