电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。
Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.
主要就乙二胺在电刷镀铜溶液中的作用及其对镀铜层性能的影响进行了试验研究。
The effects of C2N2H8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper.
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
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