结果表明，当浆料介质中铜离子浓度增加时，低铬白口铸铁的腐蚀磨损耐磨性降低。
The results show that the corrosion wear resistance of low chromium white cast iron decreases with the increase of Cu2 + ion concentration in slurry.
探讨了影响分离效率的各种因素——主体溶液中铜离子浓度、活性剂浓度、凝聚剂浓度、气流速度等。
The factors affecting the separating efficiency such as the concentration of copper ion in bulk solution, the concentrations of surfactant and flocculant, and the gas flow velocity, were investigated.
并用循环伏安法研究铜砷共沉积过程中铜离子浓度、砷离子浓度等因素对铜沉积过程峰电流密度和峰电势的影响。
Cyclic voltammetry was also used to study the effect of content of cupric ions and arsenic ions on peak current density and peak potential of cyclic voltammetry graphs of copper electrodeposition.
研究电解温度，电流密度，铜离子浓度等对阴极铜质量的影响，通过目测和金相显微观察的方法对影响效果进行评价。
The effect of electrolytic temperature, current density and concentration of copper-ion on the surface quality of copper on cathode was investigated.
溶液中铜离子浓度及腐殖酸浓度的增加会使络合率呈现上升的趋势，这主要与腐殖酸溶液提供的络合点位及金属离子对络合点位的竞争有关。
The main reason is the binding sites on the humic acid and metal ions' competition for them. However, along with ionic strength increasing, the complexation capacity was decreased.
化学位图分析表明，铜离子总浓度是影响氯脱除率的主要因素。
The diagram of chemical potential shows that the total concentration of cupric ions is main influence factor on chloride precipitation.
HCY在生理浓度铜离子存在下可能通过氧化应激损伤的机制而导致血管内皮细胞凋亡。
The apoptosis in vascular endothelial cells induced by HCY plus copper was involved in the mechanism of oxidative stress-mediated injury.
因而植物体在长期的进化过程中形成了一套内稳态机制来调控铜离子在细胞中的浓度；
Thus, plants evolve mechanisms to detoxify Cu in the cell by approaches of cellular homeostasis.
本研究报道了界面带电、浓度效应、阴离子共吸附对铜在金（ 100 ）表面的欠电位沉积层的稳定性所造成的影响。
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.
本研究报道了界面带电、浓度效应、阴离子共吸附对铜在金（ 100 ）表面的欠电位沉积层的稳定性所造成的影响。
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.
应用推荐