最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
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