第三届太阳电池浆料与金属化技术将于2017年3月21日在江苏常州召开。
3rd Solar Cell Paste Metallization Forum will be organized by ASIACHEM on 21 Mar. 2017 in Changzhou, Jiangsu, China.
进一步提出了金刚石表面金属化的模型和技术途径。
Furthermore, the model of the metallization of diamond surface and technical process have been put forward.
介绍了碳纤维复合材料天线采用转移法进行表面金属化的技术。
This paper describes the technology of the carbon fiber antenna metalizing by transfer.
重点介绍了片式多层陶瓷电容器(MLCC)的技术现状，综述了多层陶瓷电容器(MLCC)的小型化、高容量、贱金属化及环保化的发展趋势。
The development tendency of MLCC regarding its miniature, high capacitance, base metal electrode, environmental protection were introduced, and especially the technology status of MLCC.
此项研究技术已用于电力电容器绝缘瓷套表面金属化的实际生产中。
The technology applied successfully in the production of the metallization for insulated porcelain sleeve on the surface of the power capacitor.
采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。
Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.
本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。
The technology of the plating through hole of the printed circuit board was briefly introduced the plating through hole technology of the microwave printed circuit board were also illuminated.
探讨了金属化的工艺条件，运用XPS，XRD，SEM等现代分析技术研究了界面现象及粘附机理。
The metallization process was studied. The interface phenomena and combined mechanism of metallization film were studied with the help of XPS, XRD and SEM analyses.
不同于传统的塑料表面处理，3d -MID对金属化的选择性要求非常高，技术上有很高的难度。
It is not like the conventional plating on plastic, the metallization selectivity is very important for 3d-mid Product, which depend on people experience and skill a lot.
提出了一种对光纤和光纤光栅进行金属化保护的方法，该方法基于化学镀-电镀技术。
We present a method for metal coating optical fiber and in-fiber Bragg grating. The technology process which is based on electroless plating and electroplating method is described in detail.
提出了一种对光纤和光纤光栅进行金属化保护的方法，该方法基于化学镀-电镀技术。
We present a method for metal coating optical fiber and in-fiber Bragg grating. The technology process which is based on electroless plating and electroplating method is described in detail.
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