运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。
An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.
但纯锡电镀中存在着许多问题，如锡晶须、镀层变色及镀液混浊等。
However, it suffers from some problems such as tin whisker, surface color changes and bath mudding.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
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