电镀药水：含有欲镀金属离子的电镀药水。
Pilot line chemicals: contain of ions to gold-plated plating potions.
电镀药水搅拌，循环不均或金属补充不及消耗。
Electroplating mixing potions, uneven circulation or metal added less than consumption.
电镀槽：可承受，储存电镀药水的槽体，一般考虑强度，耐蚀，耐温等因素。
Electroplating trough: bearable, storage solutions, the pilot line chemicals general considerations intensity, corrosion resistant, heat resistance, and other factors.
镀液比重：基本上比重低，药水导电差，电镀效率差。
Solution: basically, the proportion of lower proportion potion is poor, poor efficiency conductive plating.
电镀位置：镀件在药水中位置，与阳极相对位置，会影响膜厚分布。
Electroplating position: in a location in the plating liquid, and the relative position of the anode, can affect the film thickness distribution.
显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.
显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.
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