印刷电路板组装清洗后，常常留有许多白色残渣，这些残渣由许多的化学物反应而成。
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions.
我们已经设计出一种全新的定点方法，针对采用特定焊料、回流设定和清洗方法的电路板进行性能合格测试。
A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow Settings and cleaning methods.
本文主要介绍了印制电路板组装件焊接后非ods清洗剂清洗质量表征参数的测量方法。
The measurement method of the characteristic parameters of the cleaning quality about welded printed circuit board assembly cleaned by non-ODS cleaner is introduced in this paper.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
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