激光焊点直径小、受热范围小，焊后不会出现气孔、塌陷、热应变及金相组织变化等现象，极大减小焊后处理工序。
Welding does not occur after pores, collapse, thermal strain and microstructure changes and so on. Significantly reduce post -weld treatment process.
激光焊点直径小、受热范围小，焊后不会出现气孔、塌陷、热应变及金相组织变化等现象，极大减小焊后处理工序。
Welding does not occur after pores, collapse, thermal strain and microstructure changes and so on. Significantly reduce post -weld treatment process.
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