MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
直接硅片技术能直接在熔融晶中制成单片晶圆，不需要切割。
Direct wafer makes individual wafers straight from molten silicon-no cutting required.
更小的芯片通常意味着更快的速度，更低的能耗，更重要的是，它意味着更佳的预算——因为单个晶圆可以切割成更多的芯片。
Smaller chips usually mean faster speed, lower power consumption and, importantly, better margins-since more chips can be sliced from a single slab of silicon.
硅晶圆大圆片上切割而成的一个小片半导体材料。
Die: a single piece of semiconductor material that has been cut from a slice by scribing and breaking.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
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