理论分析了复合基底的微尺度残余应力及其热敏电阻，表明它们对器件的性能影响不可忽视，需要在设计时候给予考虑。
Residual stress and thermal induce resistance of complex substrates are theoretical analyzed, and these parameters can't neglect when the MEMS devices are designed.
理论分析了复合基底的微尺度残余应力及其热敏电阻，表明它们对器件的性能影响不可忽视，需要在设计时候给予考虑。
Residual stress and thermal induce resistance of complex substrates are theoretical analyzed, and these parameters can't neglect when the MEMS devices are designed.
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