所述微波系统包含一组设在各隔层底表面上的微波组件。
The microwave system comprises a set of microwave assemblies arranged on the bottom surface of each partition layer.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
采用这些先进技术，能提高生产效率，降低微波组件的制造成本。
The advanced technology will greatly improve microwave modules' production efficiency and reduce the production cost.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.
客户服务内容：宽带低噪声放大器系列、功率放大器系列和无源产品系列，以及定制的微波组件。
Customer Service: Broadband low-noise amplifiers, power amplifiers and passive product lines, as well as custom microwave components.
研制相控阵导引头面临复杂电磁环境、目标隐身、弹体扰动、弹目机动和专用微波组件等关键技术。
The manufacture of phased array seeker is faced with some key techniques, such as complex electromagnetic environment, target stealth, disturbance of missile body, movement...
激光技术与自动测试技术、自动控制技术相结合可实现对微波组件的高精度动态闭环自动化测试修调。
Laser technology, combined with the automatic control and testing technology, can be used for automatic high precise accuracy tuning of the microwave modules.
研究了由单片微波集成收发组件所构成天线阵的可变极化扫描问题。
The beam scan with variable linear polarization directions of antenna arrays using MM/C transmit-receive (T/R) modules is explored.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
目前，该软件已作为“微波管模拟器套装”的一个组件在一些科研单位得到了推广应用，并获得了良好的评价。
Currently, as a component of Microwave Tube Simulator Suite, this soft has been widespread used in some research entities, and gained good evaluation.
着重从可靠性和合成效率方面，利用电路设计手段和软件CAD仿真技术进行250w微波固态功放组件的研制。
From reliability and combination efficiency aspects, a 250w microwave solid-state PA module is designed and made by circuit design and CAD software simulation.
该测试设备可实现对引信收发组件、主通道微波接收机、修正通道微波接收机的各项功能的测试。
These test equipments can measure every parameter of fusee subassembly, main passway microwave receiver and revise passway microwave receiver.
提出了微组装电路组件在微波功放控制电路中的应用，介绍了微组装电路组件的散热措施。
This paper introduce the application of micro assembly circuit micro module in microwave power amplifiers and its thermal management.
本文介绍了用于微波中继系统发射机的功率放大器、调相器、上变频器等组件的原理和特性。
This paper presents the principles and characteristics of the following modules: power amplifier, phase modulator and up converter, which are used in the transmitter of 1GHz microwave relay system.
本课题针对星载应用的微波固态功放组件及其幅相特性进行研究。
This paper makes researches on microwave solid-state pa modules used in spaceborne radar and their A-P characteristics.
本课题的成功研究为微波固态功放组件的星载应用提供了一定的技术参考。
The success in this topic provides technical references for microwave solid-state pa modules used in spaceborne radar.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
作为射频与微波系统的重要组件—微波功率薄膜电阻器可广泛应用于雷达、通讯、电子对抗等领域。
Microwave power thin film resistors were widely used as an important component of RF and microwave system in radar, communications, electron countermeasure et al.
作为射频与微波系统的重要组件—微波功率薄膜电阻器可广泛应用于雷达、通讯、电子对抗等领域。
Microwave power thin film resistors were widely used as an important component of RF and microwave system in radar, communications, electron countermeasure et al.
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