• 他用另一石头锤子击打那个金色的

    He used another rock as a hammer to hit the gold-colored lump.

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  • 复数设置主动

    Pluralities of projections are disposed on the active surface.

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  • 导电凸块纵向尺寸大于通孔的纵向尺寸。

    The size of the conductive bump is bigger than the longitudinal size of the through hole.

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  • 凸块相对于掣动杆中心偏心

    The middle column and the projections present an eccentric shape correspondingly to the center of the fixed pawl body.

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  • 碟表面密布梯形凸块圆形凹坑气孔

    The surfaces of the discs are covered with trapezoidal protrusions, circular indentations and air holes.

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  • 发明弹性可以用来检测接合工艺品质

    The elastic bump according to the invention can be used for testing quality of jointing technology.

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  • 他们的卡车到了路上凸块,一个西瓜滚下去烂了。

    Their truck hits a bump, and one melon falls off and shatters.

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  • 反应下面设有法兰盘,该法兰盘上设有一个定位

    A flange is arranged under the reaction tube and provided with a positioning convex block.

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  • 接着提取特征基本参数判断识别出凸块特征类型

    Then, the parameters of stock feature were extracted and the type of stock feature was distinguished.

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  • 基础挡土墙底板底面设置一个与底板整体榫状

    Tenon foundation is tenon type integer block under the foundation slab of retaning wall, which is part of foundation slab.

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  • 当然速度凸块不要停止程序员编码解码数据编写函数

    Of course, the speed bumps don't stop programmers from writing the functions to encode and decode the data anyway.

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  • 第二配置于基其中第二凸块高度高于第一凸块高度。

    The second bump is disposed on the substrate, wherein the height of the second bump is higher than the height of the first bump.

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  • 介电导电周围表面更包覆于基材部分表面上。

    The dielectric layer only covers the peripheral surface of the conductive bump or the partial surface of the substrate.

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  • 进行蚀刻平坦化该些凸块表面;移除该图案化光阻层;

    Then fulfill the etching for these bumps to flatten the surface of these bumps.

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  • 发明公开了一种具有环状支撑物凸块结构其适于配置于一基板

    The invention discloses a projection structure with a ring support, which is adapted to be engaged on a base plate.

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  • 边缘构件最好形成具有凸块以便底座与箱盖盒与箱盒之间的啮合

    Edge members are preferably formed with protuberances to allow for better base-to-lid and case-to-case engagement.

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  • 翻译是:类似银河系主要组件核心m31凸块光盘光环

    Similar to the Milky Way Galaxy, the main components of M31 are nucleus, bulge, disc and halo.

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  • 焊料凸块含钴底部金属层结合可延长无铅焊接倒装的寿命。

    The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.

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  • 以及第一,填充在所述第一芯片述第二芯片之间,且包覆所述第一凸块

    The first underfill is filled between the first chip and the second chip in order to wrap the first bump.

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  • 主要技 术特点在药周围设有高弹性支撑物,所述的上设有按摩

    The main technical characteristics are that a high-elastic support is arranged around a powder core, and the powder core is provided with massage projections.

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  • 使用背面按摩人体背部穴位进行刺激,起到按摩放松作用

    When the inflatable bag is used, massage protruding blocks on the back of the bag body stimulate the acupuncture points on the back of the human body so as to have the massage relax function;

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  • 由于壳体相对外侧面上对应设置梯形凹槽凸块,而根据需要任意扩充

    Moreover, because the opposite lateral surfaces of the case are correspondingly provided with ladder-shaped grooves and bumps, modules can be optionally expanded according to requirements.

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  • 文章通过试验证明纯锡焊料底部凸块金属焊层结合可延长无铅焊接倒装寿命

    In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.

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  • 本实验显示经过最佳化传输线路设计凸块分布,低成本高效封装结构目标可以达成。

    With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.

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  • 发明提出基板结构其包括至少一第一电极、至少一第一凸块以及至少一第二凸块

    The invention provides a bump structure on a substrate, comprising at least a first electrode, at least a first bump and at least a second bump.

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  • 洗涤衣物直接起到搓衣作用避免由于使用搓衣板洗衣物时所带来不便。

    The salient parts or salient bars can play the role of a washing plate directly when clothes are washed, thus avoiding the inconvenience caused by the use of a washing plate in washing.

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  • 本文成型压板过流面积、凸块高度等结构因素效果影响这种造型方法的紧实机理进行了探讨。

    In this paper, the compact mechanism of molding method and the effect of compact result which were attributed by the configur

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  • 撑臂两侧往上延伸,所述斜状墙的前端段侧面各贯设前段顶面各设置一撞击凸块

    The bilateral slot walls of the shrinking bunch are respectively provided with a wall hole and an inclined salient wall is extended from the both sides of the subsidiary arm brace.

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  • 以及多个第二配置在所述第二芯片所述对接之间使所述第二芯片透过所述第二凸块所述对接基板连接

    The second bumps are disposed between the second chip and the joint substrate so that the second chip can be connected with the joint substrate electrically.

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  • 以及多个第二配置在所述第二芯片所述对接之间使所述第二芯片透过所述第二凸块所述对接基板连接

    The second bumps are disposed between the second chip and the joint substrate so that the second chip can be connected with the joint substrate electrically.

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