介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
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