第一个集成电路(由德州仪器的杰克·基尔比发明，见上图)是个庞然大物。
The first integrated circuit (invented by Jack Kilby of Texas Instruments, see above) was a clunky affair.
其实，早在大萧条之前，经济情况远比今天严重得多，持续时间也更长(见上图)。
Even before the Great Depression, downturns were typically much deeper and longer than they are today (see right-hand chart).
如上图所示，可伸缩性拓扑的性能比较的吞吐量比黄金拓扑要大两倍。
As shown, the scalability with high availability topology was able to run twice the throughput of the golden topology.
上图是海啸马上就要到达苏兹贝格冰架时拍摄的，下图是五天后大冰块流到洋面上时拍摄的。
The top image was taken just before the arrival of the tsunami at the front of the Sulzberger ice Shelf, while the bottom image shows the chunks of ice well out to sea just five days later.
上图所示的是3月31日的大其力（Tachilek），从邻国泰国通过友谊桥，这是你到达的第一个缅甸城市。
Tachilek, shown here on March 31, is the first Burmese town you'd hit crossing the friendship bridge from neighboring Thailand.
我在瑞士巴塞尔（瑞士西北部城市，在莱茵河畔）住过几年，同样是一个相当大的交通枢纽。但是它在哪一个方面看起来都比不上图片上的武汉。
I lived a few years in Basel, Switzerland, also a very sizable transportation hub in Europe. And it looks nowhere close to this picture from Wuhan.
看到上图山的一边刻了很大的“大”这个汉字吗？我们猜想在盂兰盆会或其他的日本传统节日中，可能会起火点燃这个部分吧？
Notice the kanji character for "big" on the hillside in the above photo. Reckon they would light it up during Obon or some other festival.
上图的接法如果应用在ATE（自动测试仪器）中，可以有效地克服被测对象因负载电流大而引起的噪声干扰。
This scheme can be usefully employed in an ATE system where accurate measurements must be performed on devices with high power-supply currents that may be noisy.
找一块大挂板，贴上图片、座右铭和其他你希望实现的东西。
Get a big piece of poster board and fill it with picture, affirmation, and other things you want to manifest in your life.
上图中通过形象的手段所表现出的就是从“大”到“小”再到“少”的这一过程。
To cut short the diminishing process, the method suggested above is an effective shortcut to reduce big to small and small to less.
日前在日本东京品川举行的微软2011大会上，列出了最低硬件要求(如上图所示)。
During the Microsoft Conference 2011 in Shinagawa Japan, a slide was presented (as seen above) that details the revised low-end chassis.
日前在日本东京品川举行的微软2011大会上，列出了最低硬件要求(如上图所示)。
During the Microsoft Conference 2011 in Shinagawa Japan, a slide was presented (as seen above) that details the revised low-end chassis.
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