The fabrication techniques with dissolved wafer process of sensitive element are expressed.
叙述了敏感元件的体硅溶解薄片法制造工艺。
This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process.
论文基于普通的体硅工艺设计实现了一个单片集成式硅微惯性测量组合。
Speaking at the recent Technology Review Emtech conference, Sachs says he can lower costs using a new manufacturing process called "direct wafer."
在最近的技术评论会议上，Sachs提出使用一种被称为“直接圆晶”的新制造流程可以降低成本。
The new company will continue producing semiconductors on a 300 mm wafer line and use a 65nm production process.
新工厂将继续在300mm晶圆上利用65nm制程生产Cell处理器等。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
The process begins with a four-inch silicon wafer. A coating of metal is added and sputtered across the wafer.
该过程刚开始是利用一个四英寸的硅晶片，然后在其表面溅射一层金属涂层。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Quality of quartz crystal wafer is determined by its electrical parameters, so it is of great importance to measure its parameters accurately in the process of manufacture.
石英晶片电参数决定了其产品质量优劣，因此在石英晶片生产加工过程中精确测试其电参数尤为重要。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
Etch - a process of chemical reactions or physical removal to rid the wafer of excess materials.
蚀刻-通过化学反应或物理方法去除晶圆片的多余物质。
In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action.
在硅片研磨过程中，由于应力的积累和剧烈的机械作用，硅片表面损伤严重，碎片率增加。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
This article introduces the clean process of RCA for silicon wafer, and the design and apply in the manufacture of this kind of silicon wafer auto clean equipment.
主要介绍了半导体晶圆rca清洗工艺以及半导体晶圆自动清洗设备在生产中的结构设计和应用情况。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
According to the present invention, defects of traditional wafer bonding process can be avoided.
本发明可避免传统晶片粘合工艺的缺点。
This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.
加速度计用普通的N型硅片制造，为了刻蚀高深宽比的结构，使用了深反应离子刻蚀（DRIE）工艺。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
CEO Paul Otellini showed off Intel's first wafer of silicon chips made with a next-next-generation 22-nanometer manufacturing process.
首席执行官欧德宁展示了英特尔的一个下一代的下一代22纳米硅芯片制造过程中取得第一个晶圆。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
A quantitative mechanism of particle removal from silicon wafer surfaces by wet chemical cleaning process was proposed.
对化学法清洗硅片过程中消除颗粒的机理作了定量的探讨。
It represents creativity and practicability of wet bench in process modules and wafer servo motor transportation.
在工艺模块和伺服机械传送方面体现了湿法化学的独创性和实用性。
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
Automatic Water baking Machine: a wafer production equipment with electric power or LPG to generate the heat energy for automatic completion of mixture and baking process.
隧道式烤炉：是生产威化饼设备、下浆、烘烤、出饼片全自动完成，热能采用电或液化气。
Automatic Water baking Machine: a wafer production equipment with electric power or LPG to generate the heat energy for automatic completion of mixture and baking process.
隧道式烤炉：是生产威化饼设备、下浆、烘烤、出饼片全自动完成，热能采用电或液化气。
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