Wafer Die Disposition: Various functions related to wafer manufacturing and test.
WaferDieDisposition：各种与晶片制造及测试相关的功能。
Semiconductor wafer manufacturing: batch, semi-automated 25-wafer, single or dual chamber chemical stripping, developing and cleaning tool.
我公司再生产喷雾溶剂工具：半自动化，25晶圆，单或双室化学剥离，研发及清洁工具。
In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number.
针对晶圆制造系统的多重入特性，提出了层周期、逻辑层数等概念。
The goal of LCTI-M is to develop a wafer scale manufacturing process that will make thermal imagers affordable and accessible to every warfighter.
LCTI - M的目标是开发一种晶圆级制造流程，这将使热成像仪普及应用到美军每一名士兵。
Speaking at the recent Technology Review Emtech conference, Sachs says he can lower costs using a new manufacturing process called "direct wafer."
在最近的技术评论会议上，Sachs提出使用一种被称为“直接圆晶”的新制造流程可以降低成本。
In 2003, IBM Microelectronics recognized the need for more flexibility to react to changing manufacturing requirements associated with wafer and module manufacturing across multiple sites and vendors.
年，IBMMicroelectronics认识到需要更大的灵活性，以满足与跨多个场所和供应商的晶片和模块制造关联的不断变化的制造需求。
Virgin test wafer - a wafer that has not been used in manufacturing or other processes.
原始测试晶圆片㠰-还没有用于生产或其他流程中的晶圆片。
Test wafer - a silicon wafer that is used in manufacturing for monitoring and testing purposes.
测试晶圆片駦-用于生产中监测和测试的晶圆片。
Wafer fabrication is one of the most complex and high competence manufacturing. How to fully utilize the machine capacity to meet customer demand is a very important topic.
晶圆制造为现今最复杂与高度竞争制造环境之一，因此，充分利用其现有产能来满足顾客需求，为一相当重要的课题。
The invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.
本发明公开了一种具有穿导孔的硅晶片及其制造方法。
With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.
随着集成电路(IC)制造技术的飞速发展，为了进一步增加IC芯片的产量和降低单元制造成本，硅片趋向大直径化。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前，化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。
CEO Paul Otellini showed off Intel's first wafer of silicon chips made with a next-next-generation 22-nanometer manufacturing process.
首席执行官欧德宁展示了英特尔的一个下一代的下一代22纳米硅芯片制造过程中取得第一个晶圆。
Provided is a method for manufacturing a semiconductor light emitting element, by which a sapphire wafer can be divided into chips accurately at an extremely high yield.
本发明提供一种半导体发光元件的制造方法，使蓝宝石晶片形成芯片时，能够以极高的成品率正确地形成芯片。
Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer.
Jiro Kajiwara：晶片传送装置和晶片研磨装置，以及晶片的制造方法。
A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate;
一种制造喷墨打印头的方法，包括：准备具有（110）晶面取向的单晶硅晶片作为基板；
With the application of larger diameter silicon wafer, high precision grinding is widely used for its manufacturing.
随着大直径硅片的应用，硅片的超精密磨削得到广泛的应用。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
一种晶圆级镜头模组及其制造方法。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
一种晶圆级镜头模组及其制造方法。
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