High temperature processing allows for increased deposition rates and decreased specific resistivity values for the deposited copper films.
高温处理会增加沉积速率，减少铜沉积薄层的电阻率。
Influence of process factors including hole diameter of filter, pressurised head and temperature, on the specific resistivity of aluminum was studied.
主要研究了过滤器孔径、工作压头及温度等工艺因素对铝电阻率的影响。
Influence of process factors including hole diameter of filter, pressurised head and temperature, on the specific resistivity of aluminum was studied.
主要研究了过滤器孔径、工作压头及温度等工艺因素对铝电阻率的影响。
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