Both types of chip are manufactured in batches on a single semiconductor wafer that is cut into individual chips.
这两种芯片都是先在一张半导体薄片上成批生产，然后再切割成一个个芯片的。
A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。
Content and methods of shop-floor control in semiconductor wafer fabricati…
本文介绍了半导体晶圆制造车间层控制的内容及方法。
We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.
本文描述了使用共面微波探针的半导体芯片在片测试技术。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
To provide a method and apparatus for heating fluid in the proximity head of a semiconductor wafer processing system.
提供了一种用于加热接近头中的流体的设备和方法。
Applicable scope: semiconductor wafer, optical glass, horologe parts, glasses, jewelry, polyester filtering cores, etc.
适用范围：半导体硅片，光学玻璃，钟表件，眼镜，珠宝首饰，涤纶过滤芯等。
The invention provides a semiconductor wafer, a semiconductor chip and a method and an apparatus for processing the wafer.
本发明提供了半导体晶片、半导体芯片及处理晶片的方法和设备。
Based on the classification on the scheduling for semiconductor wafer lines, the modular and reconfigurable framework is proposed.
在分析半导体生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
该半导体晶片上形成的一层互连膜与绝缘膜的可靠性可以在加速条件下加以评估。
By adopting the method of the embodiment of the invention, the stability and the production efficiency of the produced semiconductor wafer can be improved.
采用本发明实施例的方法能够提高生产的半导体晶圆的稳定性和生产的效率。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
应用推荐