• Spintronics holds great promise for creating circuits that are faster and more energy efficient than standard semiconductor devices.

    自旋电子学在创建更高速、更节能的电路元件方面比标准半导体器件拥有更大的潜力。

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  • The lamps' small size makes them comparable to light -emitting diodes but the new lamp generates much brighter light than those semiconductor devices do.

    凯若维森灯的小巧外形与发光的二极管相似,但前者比那种半导体装置发出的光更加明亮。

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  • The materials can be made in a variety of morphologies and could be used in semiconductor devices, optics or batteries.

    这种纳米材料可以制成不同的形态,能用于半导体、光学、电池等领域。

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  • The hydrodynamic and the drift-diffusion models are the most widely used models to describe semiconductor devices today.

    在所有描述半导体的数学模型中,流体动力学模型和漂移扩散模型是应用最广泛的模型。

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  • Structure and method are provided for semiconductor devices.

    为半导体器件提供结构和方法。

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  • Now imagine this modular design idea being extended to semiconductor devices.

    现在设想一下:这种模块化设计理念延伸到半导体设备。

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  • Thermistors are semiconductor devices whose resistance varies with temperature.

    热敏电阻是一种半导体元件,它的电阻随温度而变化。

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  • A single stress liner (120) is applied over different type semiconductor devices.

    在不同类型的半导体器件之上施加单应力衬里(120)。

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  • The asymptotic behavior of the drift diffusion model for semiconductor devices is studied.

    研究半导体器件的漂移-扩散模型方程解的渐近性。

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  • Some comments on the applications of these semiconductor devices in low temperatures are presented.

    并对半导体器件在低温下的应用提出了几点看法。

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  • Novel methods and apparatuses for annealing semiconductor devices in a high pressure gas environment.

    一种用于在高压气体环境中对半导体器件进行退火的新颖方法和设备。

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  • Many semiconductor devices discussed in the previous chapters can be operated in the microwave region.

    前面几章讨论的许多半导体器件都可以在微波波段运行。

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  • The present invention relates to methods and structures for the metallization of semiconductor devices.

    本发明涉及半导体器件的金属化的方法和结构。

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  • The overall semiconductor devices are mainly used to design high-speed launchers for ultrasonic pulse detection.

    主要采用通用性半导体器件来设计超声检测用高速脉冲发射器。

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  • Technique for distribution of semiconductor devices that is particularly suitable for automatic placing machines.

    半导体器件的分发技术,尤其适用于自动放置机器。

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  • Potential application of WBG semiconductor devices in active phased array radar are discussed in this paper as well.

    宽禁带半导体器件在有源相控阵雷达中的潜在应用在文中也进行了讨论。

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  • A novel sparse matrix technique for the numerical analysis of semiconductor devices and its algorithms are presented.

    本文提出了一种用于半导体器件数值分析的新颖的稀疏矩阵技术及其算法实现。

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  • The element is used to harden certain steels, among other metallurgical uses, and is also used in semiconductor devices.

    广泛用于提高钢的淬硬性以及其它冶金工业,也用作半导体。

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  • A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented.

    本发明提供用于ULSI半导体器件的具有自组装单分子层的铜线及其制造方法。

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  • The technique could provide a new method for constructing analogues of electronic semiconductor devices, such as optical switches.

    这种技术也许为模拟半导体电子设备提供了一个新的方法,例如:光学开关。

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  • VDMOS is a new generation of power semiconductor devices, the microelectronics and power electronics technology integration together.

    VDMOS是微电子技术和电力电子技术融和起来的新一代功率半导体器件。

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  • The reliability of semiconductor devices has become increasingly important in their applications for both civilian and military systems.

    随着半导体器件在民用和军用系统中广泛的使用,器件的可靠性问题研究越来越重要。

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  • The semiconductor devices are transferred among the test tray, the buffer tray and the customer tray by first and second picker systems.

    通过第一及第二拾取器系统在该测试盘、该缓冲盘及该用户盘之间传送该半导体器件。

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  • This weapon generates a very short, intense energy pulse producing a transient surge of thousands of volts that kills semiconductor devices.

    该武器能在很短时间内产生高能脉冲,并进而产生瞬间数千伏电压聚增以破坏半导体设备。

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  • The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits.

    本发明所环氧树脂组合物可以有效地用于封装各种类型的半导体器件,如晶体管、集成电路。

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  • The noise components estimation of semiconductors is the precondition of reliability screening of semiconductor devices using noise measurement.

    半导体的噪声成分估计是利用噪声进行器件可靠性筛选的前提条件。

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  • Compared with semiconductor devices, vacuum microelectronic devices can work with higher frequency and larger power at a wider range of temperature.

    真空微电子器件相对于半导体器件来说,有着更高的工作频率和输出功率,正常工作温度范围也相对较大。

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  • Compared with semiconductor devices, vacuum microelectronic devices can work with higher frequency and larger power at a wider range of temperature.

    真空微电子器件相对于半导体器件来说,有着更高的工作频率和输出功率,正常工作温度范围也相对较大。

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